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Домой > продукты > машина pcb depaneling > Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly

Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly

Детали продукта

Место происхождения: Цзянсу, Китай

Фирменное наименование: YUSH

Условия оплаты & доставки

Количество мин заказа: 1 комплект

Цена: $8,000 / set

Лучшая цена
Выделить:

Pulse-heated soldering machine for FPC

,

High-precision PCB welding equipment

,

Pulse heat welding for board assembly

Масса:
110 кг
Рабочая зона:
110mm x 150mm
Температурная толерантность:
+2℃
Воздушное давление работы:
0,5-0,7 МПа
Модель:
ЯСПП-1А
Размер:
500 мм х 750 мм х 910 мм
Температурный диапазон:
0-400 ℃
Отжимать время:
0-99s
Прессование толерантности:
0,05 МПа
Сила сцепления:
3900 Н.
Возможность шага:
0,25 мм
Основные компоненты:
Мотор
Контроль давления:
Цифровой Программируемый
Контроль температуры:
ПИД-регулятор с замкнутым контуром
Модуль выравнивания:
Дополнительная ПЗС-матрица
Масса:
110 кг
Рабочая зона:
110mm x 150mm
Температурная толерантность:
+2℃
Воздушное давление работы:
0,5-0,7 МПа
Модель:
ЯСПП-1А
Размер:
500 мм х 750 мм х 910 мм
Температурный диапазон:
0-400 ℃
Отжимать время:
0-99s
Прессование толерантности:
0,05 МПа
Сила сцепления:
3900 Н.
Возможность шага:
0,25 мм
Основные компоненты:
Мотор
Контроль давления:
Цифровой Программируемый
Контроль температуры:
ПИД-регулятор с замкнутым контуром
Модуль выравнивания:
Дополнительная ПЗС-матрица
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly
Pulse-Heated Soldering Machine for FPC to PCB Board
High-precision pulse heat welding equipment for board assembly with advanced thermode technology for reliable FPC to PCB bonding.
Model Specifications: YSPP-1A
  • Accurate tin press without dragging
  • Precise temperature control
  • Fine-pitch positioning capability
  • Digital program pressure control
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 0 Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 1
Advanced Features
  • Rotary table design enables extremely short cycle times with simultaneous loading/unloading during heat sealing
  • High quality heat seal application up to 0.25mm pitch
  • Pneumatic bonding head provides up to 3,900N force
  • Digital programmable pressure control with LCD display
  • Closed loop PID temperature control with visible LED display
  • Real-time pressure sensor triggered bonding cycle
  • Floating Thermode ensures consistent pressure and heat transfer along flexfoil to LCD and/or PCB
  • Precision product fixtures (2X) with easy exchange, micrometer alignment, and vacuum component fixation
  • Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch applications
  • Full microprocessor logic control for reliable operation
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 2 Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 3
Technical Parameters
Parameter Specification
Model YSPP-1A
Size 500mm × 750mm × 910mm
Work Air Pressure 0.5-0.7 MPA
Working Area 110mm × 150mm
Temperature Setup 0-400℃
Tolerance of Temperature +2℃
Time of Pressing 0-99s
Tolerance of Pressing 0.05 MPA
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 4 Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 5
Technology Overview
Hot bar soldering is extremely effective for bonding dissimilar components and parts that are difficult to unite. This pulse bonding technology differs from traditional soldering by using thermode technology based on rapid reflow through pulse heating. The procedure allows materials with low temperature resistance to be soldered at high lead-free temperatures without damaging the flex circuit. The system selectively solders parts by heating them to temperatures that melt adhesives or solder, which then re-solidify to form permanent, reliable bonds.